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ADLINK DLAP-211-Orin NX/Nano Dev Kit

DLAP-211-Orin-NX/Nano-Dev-Kit

The ADLINK DLAP‑211‑Orin Dev Kit is a compact, fanless NVIDIA® Jetson™ platform designed for AI inference at the edge in industrial, transport, and smart infrastructure applications. Powered by your choice of Jetson Orin NX (up to 100 TOPS) or Jetson Orin Nano (up to 40 TOPS), it delivers high‑performance compute in a rugged, ultra‑compact 148 × 120 × 52 mm chassis with an extended ‑20 °C to 70 °C operating range. With PCIe Gen3 NVMe storage, rich industrial I/O, and remote device management compatibility, it is built for dependable AI deployments across ANZ.

  • Single
  • ARM
  • 16
  • 1Gb/s, 10Gb/s, 100Gb/s
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ADLINK DLAP‑211‑Orin NX Dev Kit — Compact, Fanless Edge AI for ANZ

Built on NVIDIA Jetson Orin NX (up to 100 TOPS), the DLAP‑211‑Orin NX delivers reliable, real‑time AI for industrial, transport, and smart infrastructure deployments across Australia and New Zealand.

Jetson Orin NX (6/8‑core Arm Cortex‑A78AE) Up to 100 TOPS Ampere GPU (up to 1024 CUDA + 32 Tensor Cores) LPDDR5 8GB/16GB (module dependent) M.2 2242 NVMe (PCIe Gen3 x4) USB 3.x, HDMI, RS‑232/422/485, CAN, GPIO/I²C/SPI Secure Boot & Watchdog 148 × 120 × 52 mm | Fanless | VESA/DIN rail ‑20 °C to 70 °C (configuration dependent)

Compute platform

  • NVIDIA Jetson Orin NX module (8GB or 16GB variants).
  • Arm Cortex‑A78AE CPU: 6‑core or 8‑core (module dependent).
  • Ampere GPU up to 1024 CUDA cores and 32 Tensor Cores.
  • AI performance up to 100 TOPS for real‑time inference.

Memory & storage

  • LPDDR5 8GB/16GB on‑module (high bandwidth, low power).
  • M.2 2242 NVMe SSD support (PCIe Gen3 x4) for OS/data.
  • Removable storage options supported per configuration.

I/O & industrial interfaces

  • USB 3.x and HDMI for peripherals and commissioning displays.
  • Serial: RS‑232/422/485 for PLCs and legacy equipment.
  • CAN bus plus GPIO/I²C/SPI/UART for robotics and sensors.
  • Optional expansion board for additional I/O (model dependent).

Security & manageability

  • Secure Boot support for firmware integrity.
  • Hardware watchdog timer for unmanned reliability.
  • Compatibility with remote device management ecosystems.

Form factor & environmental

  • Compact, fanless metal enclosure: 148 × 120 × 52 mm.
  • Mounting options: VESA and DIN rail.
  • Operating temperature: as low as ‑20 °C to as high as 70 °C (configuration dependent).

Wireless & expansion

  • M.2/mini‑PCIe expansion options for Wi‑Fi and cellular (model dependent).
  • Flexible module configurations to match site connectivity across ANZ.

Benefits for Australia & New Zealand deployments

  • Real‑time edge AI: Up to 100 TOPS enables multi‑stream vision and robotics without cloud latency.
  • Industrial integration: RS‑232/422/485 and CAN bridge brownfield assets with modern AI pipelines.
  • High‑efficiency design: LPDDR5 and fanless thermal design suit cabinets, vehicles, and kiosks.
  • Fast local storage: PCIe Gen3 x4 NVMe supports rapid logging, caching, and model updates.
  • Fleet‑ready operations: Secure Boot, watchdog, and remote management compatibility support distributed rollouts.
  • Deployment flexibility: Compact footprint with VESA/DIN rail mounting for tight spaces and mobile platforms.

Applications matched to the platform

  • Smart cities & transport: traffic analytics, station monitoring, roadside AI.
  • Industrial vision & QA: defect detection, measurement, line analytics.
  • Robotics & AMRs: sensor fusion, obstacle detection, navigation.
  • Retail & venues: occupancy analytics, queue detection, smart signage.
  • Energy & utilities: equipment monitoring, substation edge analytics.
  • Agritech: autonomous inspection, yield monitoring, environmental sensing.
Notes: Specifications (CPU core count, memory size, I/O, and wireless options) vary by Orin NX module and model configuration. Operating temperature and expansion options are configuration dependent.

ADLINK DLAP-211-Orin NX/Nano Dev Kit

Overview

Edge AI, Engineered for Enterprise Deployment The ADLINK DLAP-211-Orin NX/Nano Dev Kit delivers high-performance edge AI in a compact, fanless form factor built for industrial-grade reliability. Powered by NVIDIA® Jetson™ Orin NX or Nano modules, this platform supports up to 100 TOPS of AI compute, PCIe Gen3x4 NVMe storage, and robust I/O for sensor-rich environments. Designed for smart cities, manufacturing, and autonomous systems, it’s the ideal foundation for scalable AI deployments across Australia and New Zealand.

Key Features:

Built for Real-Time AI at the Edge

  • CPU Architecture: Arm® Cortex®-A78AE v8.2 64-bit (6-core or 8-core depending on module)

  • GPU: NVIDIA Ampere architecture with up to 1024 CUDA cores and 32 Tensor Cores

  • Memory: LPDDR5 (4GB, 8GB, or 16GB depending on module)

  • Storage: 128GB M.2 2242 NVMe SSD (PCIe Gen3x4)

  • Security: Secure boot, watchdog timer (WDT), and compatibility with Allxon remote device management

  • Form Factor: Ultra-compact 148mm x 120mm x 52mm, fanless, VESA/DIN rail mountable

  • I/O Expansion: USB 3.0, HDMI, CAN bus, RS-232/422/485, GPIO, SPI, I2C, UART

  • Operating Temp: -20°C to 70°C with industrial-grade components

 

Benefits:

Why Australian and New Zealand Enterprises Choose DLAP-211-Orin

  • Secure & Remote-Ready: Supports secure boot and Allxon cloud-based device management

  • Modular AI Performance: Choose Orin NX (up to 100 TOPS) or Nano (up to 40 TOPS) to match your workload

  • Industrial Durability: Wide temperature range and shock/vibration resistance for harsh environments

  • Rapid Deployment: Pre-installed Ubuntu Linux OS and plug-and-play I/O for fast prototyping

  • Compact & Fanless: Ideal for space-constrained deployments in retail, transport, and smart infrastructure

  • Flexible Expansion: PCIe mini card slot and M.2 B-key for wireless, LTE, or additional storage modules

Ideal For:

  • Smart Cities: Traffic analytics, public safety, and environmental monitoring

  • Industrial Automation: Machine vision, predictive maintenance, and robotics

  • Retail Intelligence: Customer analytics, inventory tracking, and digital signage

  • Agritech & Aquaculture: Real-time monitoring, yield optimization, and autonomous systems

  • Autonomous Vehicles: Sensor fusion, object detection, and navigation

  • Healthcare & Aged Care: AI-assisted diagnostics, patient monitoring, and facility automation

Brand ADLINK
Form Factor Industrial PCs, Fanless Embedded PCs
Platform ARM
CPU Sockets Single
Co-processor/GPU NVIDIA Jetson
Maximum RAM Capacity (GB) 16
Max Network Throughput (Gb/s) 1Gb/s, 10Gb/s, 100Gb/s
Number of Onboard Networking Ports 2
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